The photonic-process expert for advanced packaging

In the future, light will propagate

DEUVtek builds precision laser process and metrology systems for advanced packaging and compound semiconductors — we design the beam, execute the process, and verify the result.

Every breakthrough,
machines give way to light.

We design the beam · execute the process · verify the result.

Sawing became laser dicing. Grinding is becoming laser thinning. Drilling is becoming DOE-shaped via formation. One closed loop — from beam design through processing to 3D NIR verification — a control depth that neither pure tool vendors nor pure metrology vendors can offer.

±0.1 µmPosition accuracy
<0.01%Wafer breakage rate
30 µmUltra-thin wafers
>20 WPHThroughput
01 · About

Built by semiconductor specialists

“Precision is not a number on a datasheet — it is a discipline built into every optic, every motion, every habit. That discipline is what we brought from Japan to DEUVtek.”
SS
Shoichi Sakanishi
Chairman / CEO · ex-Gigaphoton Taiwan Chairman
“We aim to be a system-level force in the reorganization of the global semiconductor supply chain — not a single equipment vendor.”
JC
Dr. Jun-Yi Chyan
COO · ex-GlobalWafers Chief Technical Lead
02 · Core Competency

Advanced Design and Integration

Metasurface DOE Design

Proprietary metasurface and diffractive optics — command of beam and via geometry above every process.

Packaging Process Know-How

Validated process windows for drilling, cutting, and thinning — in glass, SiC, and beyond.

Equipment Integration & Development

From optical engine to full tool — in-house integration of laser, motion, and OCT inspection, automation-ready.

03 · Applications

Focused on advanced packaging performance

04 · Products

Two product lines

GlassForge

DOE-embedded glass substrate & waveguide assembly

DOE-embedded glass-based substrate and waveguide assembly for CPO coupling — formed, cut, and 100% OCT-verified on our own line.

GlassForge glass substrate

Phalanx

Laser process & inspection equipment

Phalanx-series laser process tools and 3D NIR OCT inspection systems — certification and automation integration included.

Phalanx laser equipment
05 · Sustainability
Give every wafer a second life.
Efficiency

Less energy per wafer

Photonic processing replaces energy-hungry mechanical steps — minutes instead of hours, watts instead of consumable-driven kilowatts.

Yield

Less material wasted

Breakage cut from ~3% to <0.01% — every wafer saved is embodied energy, water, and carbon that never has to be spent twice.

Consumable-Free

Zero consumables in the process

Photonic processing uses no diamond wheels, no slurry, no cleaning chemistry — nothing consumed, nothing sent to waste treatment.

Start the conversation.

Evaluation lots, foundry quotations, development projects, partnerships — or joining the team. One form, routed to the right people.

DEUVtek Co., Ltd.
Zhongli — 1F.-5, No. 192, Zhongyuan Rd., Zhongli Dist., Taoyuan 32063 (Zhongli Industrial Park)
Taipei — 3F., No. 15, Sec. 1, Nanjing E. Rd., Zhongshan Dist., Taipei 104010
service@deuvtek.com · +886-2-7750-6246

NDA-first for technical discussions · we reply within 2 business days